PANDUIT | GB4B0612TPI-1
Panduit GB4B0612TPI-1 Grounding Busbar

MFR PART #  GB4B0612TPI-1
PART #  323179
Minimum 1 Each
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Description

The GB4B0612TPI-1 Grounding Busbar meets BICSI and J-STD-607-A requirements for network systems grounding applications. Made of high conductivity copper and tin-plated to inhibit corrosion, comes pre-assembled with brackets and insulators attached for a quick installation. The insulators provide 600 V of insulation and use of Panduit self-laminating laser/ink jet labels to identify busbars.

Applications

Telecom/Data Center

Features

  • Meets BICSI and J-STD-607-A requirements for network systems grounding applications
  • Made of high conductivity copper and tin-plated to inhibit corrosion
  • Comes pre-assembled with brackets and insulators attached for quick installation
  • Use Panduit self-laminating laser/ink jet labels to identify busbars to meet TIA/EIA-606-A, see chart below

Tech Info

BICSI/TIA-607-C, cULus

Specifications:

Component BUSBARS
UNSPSC Code 39121400

Data Sheets

TECHNICAL DRAWING

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