Panduit GB4B0624TPI-1 Main Grounding Busbar

PART #  326835
Minimum 1 Each
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The GB4B0624TPI-1 Grounding Busbar meets BICSI and J-STD-607-A requirements for network systems grounding applications. Made of high conductivity copper and tin-plated to inhibit corrosion, GB4B0624TPI-1 comes pre-assembled with brackets and insulators attached for a quick installation. The insulators provide 600 V of insulation and use of Panduit self-laminating laser/ink jet labels can be used to identify busbars.




  • Meets BICSI and J-STD-607-A requirements for network systems grounding applications
  • Made of high conductivity copper and tin-plated to inhibit corrosion
  • Comes pre-assembled with brackets and insulators attached for quick installation
  • Use Panduit self-laminating laser/ink jet labels to identify busbars to meet TIA/EIA-606-A, see chart below

Specification Description

Telecommunications Main Grounding Busbar
Number Of 1/4 Inch Stud Hole Sets, 5/8 Inch Hole Spacing: 24
Number Of 3/8 Inch Stud Hole Sets, 1 Inch Hole Spacing: 6
Number Of 5/16 Inch Hole Sets, 5/8 Inch Spacing: 24
Number Of 7/16 Inch Hole Sets, 1 Inch Spacing: 6
Dimension: 20 Inch Length x 4 Inch Width x 1/4 Inch Height (508 mm x 102 mm x 6.4 mm )

Tech Info

BICSI/TIA-607-C, cULus


Component BUSBARS
Connection Type MECHANICAL
Material Rating COPPER
UNSPSC Code 39121400

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